THE EDGE
PROPER MATCHING BETWEEN FANS AND AIR CHANNELS AND A REFINED AIR VOLUME CONTROL TOGETHER SIGNIFICANTLY IMPROVE THE HEAT DISSIPATION EFFICIENCY OF FANS .
compatibility and signal integrity ), temperature ( air volume , airspeed and temperature rise ) and stress field ( electrical and mechanical ). Powerful computing based on the simulation achieves the optimal layout of auxiliary systems and modules under various constraints .
In addition , high-precision mockup and simulation facilitate a refined heat dissipation design and the internal modelling of components ( chips and semiconductors ) supports precise thermal flow density design for internal crystal elements of insulated gate bipolar transistors ( IGBTs ).
The software creates an optimal model for module layout , air channel design and fan selection , guiding PCB and structure design . While maintaining verification and optimisation levels , the embryo solution has developed into an optimal heat dissipation solution . The simulation platform is efficient and generates optimal results because it does not include processes standard in traditional thermal design , such as manual estimation , verification , modification and re-verification .
The multi-physical-field simulation platform boasts a precision level that is 30 % higher than the industry standard . Temperature increase simulation for rectifiers and inverters is conducted in three fields : electromagnetic ( electromagnetic
With this in mind , Huawei leverages extensive temperature sampling and data computing to control heat dissipation at all possible points . All components are tested under all working conditions . In addition , the IGBTs , inductors , diodes and bus capacitors support a large temperature margin .
In Huawei ’ s own words , every technical innovation must ultimately meet customer demands . Investments in emerging technology – represented in solutions like the FusionPower2.0 – aim to deliver a better customer experience while promoting business success . ◊
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