EXPERT OPINION
48 and 52 being implemented on a regular basis . Think of it as like real estate . It ’ s often more effective to go up instead of out .
This , and higher densities , are what is driving higher U heights . ZetaFrame is thoroughly tested and has passed through four times static load tests , tilt load testing on the load , transportation testing and simulating a 1,000-mile journey .
Our enhanced air flow management includes optional accessories ensuring effective , conditioned and exhaust air separation for maximum equipment cooling to ensure there is no hot air recirculation . The unique feature of the ZetaFrame is integrated bonding of the doors , sides , bottom and top panels . Doors automatically bond to the frame through door hinges and the top panels and side panels are bonded by metal contact points . This eliminates the need for attaching separate grounding straps to components .
The unit ground block attachment requires no additional bonding preparation and the grounding block can be installed at the top , bottom , front or rear of the cabinet . Integrated bonding ensures always-on bonding of cabinet components and simplified attachments to the telecommunications busbar .
What advice would you offer data centre teams to ensure that their facility is futureproof ?
Always talk to us at Chatsworth Products as we are always looking ahead to complete the data centre cabinets using CPI ’ s integrated ecosystem such as EAC ( electronic access control ), integrated intelligent e-connect PDUs and our industry leading passive cooling options , and cable management .
The ZetaFrame offers all this , alongside futureproof weight capacity and configurability . Considering options and properly specifying these elements from the start , will support futureproofing . It is best to address these now with the right accessories for the job in hand rather than having to troubleshoot any overheating issues or deal with unruly cabling once the cabinets are live . �
THE UNIT GROUND BLOCK ATTACHMENT REQUIRES NO ADDITIONAL BONDING PREPARATION .
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