EXPERT OPINION
In this system , we have a distribution unit , manifold unit and cooling distribution unit responsible for filling the manifold and host connections . The manifold connects to the server or chassis and is filled with a dielectric liquid to efficiently dissipate heat .
What is direct-to-chip ( D2C ) liquid cooling and why is it considered an easy-to-maintain and scalable system ? What are some challenges data centres face in the cooling process and how can they solve these challenges ?
With direct-to-chip , there is a heat pipe or cold plate which is placed in the hottest parts of the equipment like the CPU , GPU and can also be extended to other parts like memory and power supplies . A liquid flow through this component will remove heat from the server .
Using this system in your building creates one challenge . In a standard server rack , power distribution units are placed at the rear to power individual equipment . But , in incorporating liquid cooling , a manifold is needed to distribute liquid to the equipment . This means bringing liquid into the white space , getting it even closer to the IT setup and establishing a secondary fluid network inside the white space .
When is it an ideal time to implement liquid cooling and what steps should organisations take ?
There is no perfect time to start . For organisations , you need to consider your IT demands , computing demands and future strategies . There are no limitations to this technology and it can be integrated into existing white spaces without newly
Markus Gerber , Sr . Business Development Manager , nVent
built facilities . You can start by designating a corner in your white space for directorship , create a proof of concept or introduce a cube in an existing data centre based on your specific requirements .
Organisations should decide based on their kind of computing loads , even www . intelligentdatacentres . com
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