Intelligent Data Centres Issue 65 | Page 62

Hyve Solutions integrates latest Intel Xeon 6 processor for superior AI and cloud performance

Hyve Solutions , a wholly owned subsidiary of TD SYNNEX , and a leading provider of hyperscale digital infrastructures , has announced the integration of Intel Xeon 6 processors into Hyve-designed motherboards and systems .

This collaboration with Intel marks a significant step forward in meeting the diverse performance and efficiency requirements of modern computing environments , from high-performance AI applications to exceptional efficiency and cloud scalability .
Hyve Solutions is working with its customers to embrace the latest in Intel ’ s technology leadership , bringing cutting-edge advancements directly to their operations . Intel Xeon 6 is now a core component of the Hyve-designed HS9124 motherboard and are utilised in systems tailored for Deep Learning and High- Performance Computing ( HPC ) applications .
“ Intel Xeon 6 delivers unparalleled performance and scalability , making them ideal for a wide range of applications , from HPC to AI , storage and networking ,” said Steve Ichinaga , President , Hyve Solutions . “ They also enable data centre consolidation , reducing space and power requirements .”
Intel Xeon 6 processors feature two unique microarchitectures , delivering high performance and power efficiency across the widest range of workloads . Intel Xeon processors with E-cores are optimised to deliver efficiency in cloud native workloads .
While Intel Xeon processors with P-cores are optimised for parallel processing of multiple data elements , thereby ensuring exceptional performance in traditional data centre workloads . Hyve has announced products supporting Intel Xeon 6 processors with E-cores , with offering of P-core solutions in the future .
“ Intel and Hyve Solutions share a similar commitment to innovation and technology leadership ,” said Justin Hotard , Executive Vice President and General Manager , Data Center and AI Group at Intel .
“ Our most recent collaboration centred around Intel Xeon 6 processors focuses on enabling customers to maximise their investments and their system efficiency when targeting the latest HPC , AI and cloud-native workloads .”
Intel Xeon 6 processors feature the fastest DDR5 memory , including Multiplexed Combined Rank DIMMs ( MCR DIMMs ), for maximum throughput . The flexibility of Intel Xeon 6 is evident in the range of SKUs available , offering up to 144 cores and eight memory channels for high overall performance integrated into Hyve ’ s solutions .
INTELLIGENT INFRASTRUCTURE
As a fully vertical integrated original design manufacturer with SMT operations based in the US , Hyve utilises its extensive design and manufacturing expertise , along with its global footprint , to swiftly and efficiently deploy AI data centre architectures . Hyve ’ s on-going relationship with Intel underscores its dedication to providing scalable AI data centre architectures that evolve with customer needs , pushing the boundaries of what ’ s achievable in AI innovation . �
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