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DIGITALBRIDGE SIGNS STRATEGIC MOU WITH KT CORPORATION TO DEVELOP NEXT-GEN AI DATA CENTRES IN SOUTH KOREA
DigitalBridge, a global digital infrastructure investor, has signed an MOU with KT Corporation, one of South Korea’ s leading telecommunications providers, to collaborate on developing next-generation AI data centres.
The agreement marks DigitalBridge’ s first collaboration with a major South Korean telecommunications company and focuses on building large scale AI and cloud infrastructure in the country. The companies will explore AI factory-type data centres that could scale to gigawatt capacity and require multibillion dollar investment.
“ With the surge in Generative AI, cloud adoption and global data demand, South Korea is rapidly emerging as a central hub for AI infrastructure in Asia,” said Marc Ganzi, CEO, DigitalBridge.
“ Our collaboration with KT reflects our continued commitment to developing and operating next-generation digital infrastructure globally. South Korea’ s strong connectivity ecosystem, technology leadership and policy support make it an ideal market for AI-era investment.”
DigitalBridge manages approximately US $ 108 billion in digital infrastructure assets globally and has built a comprehensive platform spanning data centres, fibre, towers and Edge infrastructure. The collaboration with KT expands the firm’ s regional presence following the recent close of DigitalBridge Partners III, which secured US $ 11.7 billion in total commitments including US $ 4.5 billion in LP co investment commitments. Developed markets in Asia, including South Korea, will be a key focus for deployment under this fund.
Vertiv, a global leader in critical digital infrastructure, has announced new configurations of the Vertiv MegaMod HDX, a prefabricated power and liquid cooling infrastructure solution engineered for high-density computing environments, including Artificial Intelligence( AI) and high-performance computing( HPC) deployments. The new configurations give operators flexibility to support rapidly increasing power and cooling requirements while optimising space and deployment speed. The models are available globally.
“ Today’ s AI workloads demand cooling solutions that go beyond traditional approaches. With the Vertiv MegaMod HDX available in both compact and combo solution configurations, organisations can match their facility requirements while supporting high-density, liquid-cooled environments at scale. Our designs deliver what data centres need most – reliable performance, operational efficiency and the ability to scale their AI infrastructure with confidence,” said Viktor Petik, Senior Vice President, Infrastructure Solutions at Vertiv. �
Vertiv MegaMod HDX integrates direct-to-chip liquid cooling with air-cooled architectures to meet the intense thermal demands of AI workloads, supporting pod-style AI environments and advanced GPU clusters. The new compact solution has a standard module height and a maximum of 13 racks and power capacity up to 1.25 MW; the combo solution has an extended-height design with a maximum of 144 racks, supporting power capacities up to 10 MW. Both can support rack densities from 50 kW up to more than 100 kW per rack. The hybrid cooling architectures integrate directto-chip liquid cooling with air cooling for efficient, high-density thermal management, while the prefabricated modular designs enable accelerated deployment and allow customers to scale their data centres as demand grows.
VERTIV INTRODUCES MODULAR LIQUID COOLING INFRASTRUCTURE SOLUTION TO SUPPORT HIGH-DENSITY COMPUTING REQUIREMENTS
12 www. intelligentdatacentres. com